Fabrication of solar silicon wafer consists of wafer slicing and texturing of its surface.
太阳能硅片的制造工艺主要包括硅片的切割以及绒面制备两部分。
Wafer slicing would increase to 500mw by the end of the second quarter, with further capacity expansions in the planning stage.
第二季度末，硅片产量将会增加满足500兆瓦的产能，公司的下一步扩产产能还在计划阶段。
A solar wafer slicing method was studied, which was based on complex dielectric fluid and efficiency electric discharge machining (EDM) and electric chemical machining (ECM) technique.
提出了一种基于复合工作液的、以电火花电解复合加工技术对太阳能硅片进行切割的工艺方法。
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