The results are of importance to design and optimize of geometry shape of the solder joint.

这一结果对于焊点几何形态的设计及优化具有指导意义。

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And the different section shape of the solder joint is given with the variation of solder volume.

给出了不同的钎料量对应的焊点剖面形态的变化。

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The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.

导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。

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