The curing reaction of epoxy resin, which is common used in metal conductive paste, was studied.
主要研究了金属导电浆料中常用的环氧树脂的固化。
A special chemical that promotes or accelerates the curing reaction or reduces stoving temperature.
一种专门的化学材料，可以提升或促进固化反应或降低烘烤温度。
The curing reaction of waterborne acrylic resin with HMMM has been studied by using the torsional braid analysis (TBA).
用动力学扭辫分析(tba)法研究了水溶性丙烯酸酯树脂与六甲氧基甲基三聚氰胺的固化反应。
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