The effect of following variables on mould temperature distribution has been studied:casting speed, water velocity, wall thickness, scale deposition and galvanization layer.

讨论了拉速、冷却水流速、铜板厚度、水垢和铜板镀层对结晶器温度分布的影响。

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The porous nano-structure is used as a bonding layer, and thermocompression bonding can be realized at lower temperature and pressure due to the nano-scale effect.

利用该多孔纳米结构作为键合层，由于纳米尺度效应，可以在较低的温度和压力下实现热压键合。

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