Solid particle removal efficiency is chiefly decided by solid particle size, bubble size and the chemical properties of the solid particle surface.
气浮法的效率主要取决于固体颗粒直径、气泡直径和固体颗粒表面的化学性质。
This thesis introduces the concept, structure and properties of semiconductor ultrafine particle (SUFP), including quantum-size effect, surface effect and volume effect et, al.
介绍了半导体超细粒子的概念、结构及特性,主要是包括量子尺寸效应、体积效应、表面效应;
The diameter distribution, surface morphology, thermal properties and structure of the microcapsules were investigated by means of laser particle size analyzer, SEM, DSC and FT-IR, respectively.
利用激光粒径分布仪、扫描电镜、差示扫描量热仪(DSC)和傅立叶转换红外光谱仪分别研究了微胶囊的粒径分布、表面形态、热性能和壳结构。
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