grinding surface temperature 磨削表面温度
The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.
研究金刚石砂轮磨削单晶硅片时的表面磨削温度。
The effecting factors of grinding field temperature were analyzed. The law of roller surface layer 's temperature was researched.
系统分析了影响磨削区温度的因素，探讨磨削轧辊表层温度的分布规律。
The force and temperature of polycrystalline diamond grinding with diamond wheel are tested and analyzed, the machined surface is investigated with scanning electron microscope.
首先对金刚石砂轮磨削加工聚晶金刚石的磨削力和磨削温度进行了测试和分析，利用扫描电镜对工件加工表面进行了微观分析研究。
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