The analysis showed that it was a pseudo-diffusion interface between the film and the substrate.
界面分析认为，薄膜与基体的界面为伪扩散界面。
Diffusion of oxygen in the bonding coating and substrate is mainly grain-boundary diffusion. Grain-boundary diffusion coefficient is far greater than intragrain diffusion.
氧在粘结底层和基体中的扩散是以晶界扩散为主，晶界扩散系数远远大于晶内的扩散系数。
However, cracks initialized in the diffusion layer between substrate and bond coat when TBCs were tested with low cycle fatigue at high temperature.
而在高温低周疲劳条件下裂纹是在粘结层与高温合金基体的扩散层处。
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