All of the designs based on SMIC0.18um standard CMOS process. All of the designs are simulated in CADENCE environment.
所有设计基于SMIC0.18um标准CMOS工艺,采用在CADENCE环境下对运放进行了仿真,得到了满意的仿真结果。
参考来源 - CMOS高性能运算放大器研究与设计·2,447,543篇论文数据，部分数据来源于NoteExpress
The designed fabrication process is full compatible with standard CMOS process.
该工艺和标准的CMOS工艺完全兼容。
This circuit structure is simple and can be realized by the standard CMOS process easily.
该电路结构简单，易于实现，且制作工艺与标准CMOS工艺完全兼容。
The design of the tungsten micro-hotplate can be applied to other thermal-based sensors in the standard CMOS process.
本文的钨微热板的设计可以应用到相关的与标准CMOS工艺兼容的热传感器的设计之中。
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