零件置放 料 Receive Materials 料 Prepare Materials 零件置放 焊 Reflow Pick & Place CP7X2 膏印刷 Printing solder paste 版 Reverse Board AOI Auto Optical Inspection 膏印刷 Printing solder paste 焊 Reflow ..
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Solder paste printing 锡膏印刷 ; 如何将锡膏印刷于电路板 ; 印锡浆 ; 印刷锡膏
solder paste printing process 锡膏印刷
simulation of solder paste printing 焊膏印刷模拟
Solder Paste Printing-Stencil & Screen 锡膏印刷
The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明：在不考虑其他焊膏印刷性能影响因素下，较高的印刷速度和印刷压力能提高焊膏印刷性能。
Introduce many factors of infecting quality in solder-paste printing process and have analysed those reasons, present some corrective actions and advice at the same time.
介绍焊膏印刷中影响质量的诸多因素并分析其原因，同时提出部分纠正措施和建议。
The paper discusses the SMT process of solder paste printing for electronic product with high throughput and high-quality.
讨论了电子产品s MT制造过程中如何在产品高质量的基础上实现锡膏印刷的高生产量。
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