MMIC on-wafer probe is the key part of MMIC on-wafer measurement system.
MMIC在片测试探头是MMIC在片测试系统的关键部件。
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
Measures have been discussed for preventing the Al film for being pierced through by the probe in wafer probing on the 1034 Wafer prober.
本文打算在1034探针台上针对如何避免探针扎穿铝层问题作一讨论。
应用推荐