Molding pressure, Sinter temperature in advance and the velocity of temperature raised are the main factors for the matching of anode substrate and thin film YSZ electrolyte.
影响阳极基底与YSZ电解质薄膜共焙烧匹配性的主要因素是成型压力、预焙烧温度和焙烧升温速率。
The distributions of pressure and temperature play an important role in injection molding. The accurate prediction of the distribution is one of key techniques in injection molding.
温度与压力的分布是影响注塑成型的很重要的因素，在充模过程中正确预测温度与压力的分布是注塑成型的关键性技术之一。
Molding pressure, sinter temperature in advance and the raise velocity of temperature were the main influencing factors for the matching of anode substrate and thin film YSZ electrolyte.
影响阳极基底与YS Z电解质薄膜共焙烧匹配性的主要因素是成型压力、预焙烧温度和焙烧升温速率。
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