Chemical Mechanical Polishing 化学机械抛光 ; 化学机械研磨 ; 技术 ; 研磨
chemical mechanical polishing CMP 化学机械抛光
chemical-mechanical polishing machine 化学机械抛光机
chemical mechanical polishing cmp technology 化学机械抛光技术
chemical-mechanical polishing cmp 化学机械抛光
CMP chemical mechanical polishing 机械化学抛光
copper chemical-mechanical polishing 铜化学机械抛光
The affections of different surface treatments by mechanical polishing, chemical etching and photoetching to the properties of electrodes have also been discussed.
探讨了机械抛光、化学抛光和光抛光等不同表面处理方法对电极特性的影响。
Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
半导体器件上铜层化学机械抛光(CMP)的第一道工序一般需要使用一块硬抛光垫，在磨去阻挡层的工序中要用到软垫。
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