The gap between the cost of building a phone and its price in the shops should widen further as previously components are packed onto a single main microchip.

制造一部手机的成本和它在商店里的价格之间的差距应该会进一步扩大，因为以前元件被封装在一个主芯片上。

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But the big gap between the cost of building a smart-phone and its price in the shops should widen further as ever more previously discrete components are packed on to a single main microchip.

但是只能手机的制造成本和其在零售店里的价格的差距将会越来越大，因为过去很多分立的不见现在都能集成到一张主要芯片上了。

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These latter components compose the main bulk of the underlying price tag.

后面的这几个成分组成了基础价格的主要部分。

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