But 3dmic need the packaging material which has the higher performance (especially to microwave loss) and the production capacity which has the higher volume and lower cost.

但是3dmic需要高性能的封装材料(特别是对于微波损耗来说)，高容量、低成本的生产能力。

youdao

One way to offset the new expense is to negotiate with vendors for lower-cost ingredients and packaging, such as pizza boxes.

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