The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.

小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。

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The possibility of using ethernet at low level(namely, device level)of factory automation network was analyzed in detail and a communication profile was proposed based on Ethernet.

详细分析了在工厂自动化网络底层——设备层使用以太网的可能性，并提出一个基于以太网的通信结构框架。

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