bonding layer 粘结层 ; 粘合层 ; 结合层接着层 ; 粘贴层
Inner Layer Bonding Technology 内层连结技术
Intermediate Layer Bonding 中间介质层键合法
Waterproof bonding layer 防水粘结层
de-bonding layer 离形层
bonding interface layer 界面结合层
chip bonding layer 芯片键合层
mortar bonding layer 砂浆结合层
bonding layer slippage 粘结层滑移
The distributed force model of intelligent beam structures is presented in considering the effect of bonding layer on basis of hypothesis of linear strain in the paper.
基于线性应变假设,提出了考虑粘贴层影响的智能结构梁分布力模型。
This paper shows that the shear stress distribution in bonding layer has similar characteristics as the strain distributions near the ends of the actuator.
通过分析可得,粘贴层剪切应力的分布与致动器端部附近的应变分布有相似的特征。
In this paper, the tension bending coupling model is presented by virtual work principle, the effect of the bonding layer between beam and piezoelectric actuator is considered in the analysis.
利用虚功原理,建立了单面粘贴有压电致动器的梁结构的拉伸-弯曲耦合模型,在分析过程中,考虑了梁与致动器之间粘贴层的影响。
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