A new agent-based dynamic scheduling approach for semiconductor wafer fabrication was proposed, which integrated release control, dispatching and machine preventive maintenance scheduling.
基于智能体技术，提出了芯片制造生产线动态调度新方法，实现了投料调度、工件调度与设备维护调度的集成。
This method offers a new effective approach to implement CAPP integrated with production planning and scheduling.
这种方法为CAPP与生产计划调度的一体化集成提供了一种新的途径。
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