The contamination on contact surfaces was found to be one of the main reasons to cause electric contact failure by analyzing lots of gold plated contacts in failed mobile phones.

研究了大量失效手机中的镀金触点后发现，触点表面污染是造成电接触故障的主要原因之一。

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Gold-plated: improve conductive contact impedance improve signal transmission.

镀金：改善导电接触阻抗，增进信号传输。

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Contact resistance of carbon-plated material is much higher than that of gold plated materials. Low contact force will result in unstable resistance of C-plated material.

镀c材料的微动接触电阻值远高于镀金材料的电阻值，低接触压力下镀c材料的微动接触电阻不稳定。

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