The structure, failure model and mechanism of MCM are analyzed and the failure rate prediction model for MCM is presented.
通过对多芯片组件(MCM)的结构、失效模式和机理的分析，提出了适合我国生产实际的mcm失效率预计模型。
The general failure model and mechanism of circuit break, loose contact, instant break, male insulation, short-circuit, false matching, poor fix and bad seal were discussed.
阐述了断路、接触不良、瞬断、绝缘不良、短路、误配线、固定不良和密封不良等常见失效模式和失效机理。
Laboratory model tests are carried out to investigate the effect of inclined Angle of the anchor on the uplift capacity and the mechanism of uplift failure.
笔者通过室内模型试验对螺旋锚的倾斜角度对其上拔承载力的影响及其上拔破坏机理进行了探讨。
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