electroless Cu plating 化学镀cu
electroless Ni-Cu-P plating 化学镀Ni
electroless Ni-Cu-P alloy plating 化学镀Ni
electroless Ni-Cu plating 化学镀镍铜
regional electroless Cu-plating 局部化学镀铜
electroless plating of ni-cu 镀ni
The reaction process of electroless copper plating can be controlled by adjusting the OH-additional amounts, thus to control the morphology of Cu coatings.
通过控制镀液中OH-的补加量，能够准确控制化学镀铜反应进程及表面镀层包覆程度；
Process specifications were discussed. The affecting factors on electroless Cu plating were briefly introduced.
讨论了常温化学镀铜与着色处理的工艺规范，简单介绍了化学镀铜的影响因素。
Satisfactory colored-films on iron craftworks were obtained by coloring process of electroless Cu plating at room temperature and chemical coloring in turn.
通过对铜原子结构的分析，提出了得到良好结合力的化学镀铜层的可能性，进而给出了使用“考本”液在钢铁上直接化学镀铜的工艺。
应用推荐