An electroless deposition technique on carbon fiber with higher copper deposition rate and stability was presented.
提出了一种有较高沉铜速率和稳定性的碳纤维化学镀技术。
Deposition of metallic nickel on silicon substrate by laser-enhanced electroless plating technique is reported for the first time.
利用激光诱导化学镀技术，首次在硅片上沉积出金属镍。
Fabrication methods often include electroless plating, chemical vapor deposition, and sol gel technique, etc.
化学镀法、化学气相沉积法及溶胶凝胶法等。
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