Smooth and uniform diamond films with large area are essential for their applications in electronics due to excellent properties of diamond.
平整均匀的大面积金刚石膜是其在电子领域工业化应用的前提。
The thermal stresses in large area free-standing diamond films deposition using finite-element (FE) models with and without interlayer were investigated.
建立了没有过渡层和有过渡层的有限元模型，对大面积自支撑金刚石膜沉积过程中的热应力进行了研究。
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