• 铝渗碳化硅 - 引用次数：3

  Aluminum infiltrated silicon carbide composite exhibits excellent properties such as high thermal conductivity,low coefficient of thermal expansion ( CTE) , high modulus and low density, therefore it has extensive potential applications in electronic packaging.

  铝渗碳化硅复合材料具有高导热、低膨胀、高模量、低密度等优异的综合性能，在电子封装领域具有广阔的应用前景。

  参考来源 - 铝渗碳化硅电子封装材料的热物理性能

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