粘结接头参数是指粘结宽度B(Adhesive layerwidth)、粘结厚度D(Adhesive layer thickness)及缝隙C(Joint width),见图2所示。
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The influences of surface treatments, the pressures during bonding process and the thickness of adhesive layer on shearing strength were investigated with epoxy resin-DDS curing system as adhesive.
采用环氧树脂- DDS固化体系作为胶接剂,探讨了各种金属表面处理方法、胶接时对胶接面施加的压力、胶层厚度等因素对胶接剪切强度的影响。
The Q-factor , output gain and frequency of cleavage of resonator which were effected by the thickness of adhesive layer, material properties and defects in adhesive layer were detailedly analyzed.
重点研究了粘胶层厚度、材料特性、以及胶层中有缺陷等因素对谐振子的Q值、输出增益、频率裂解的影响。
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