IBM和3m最近宣布他们发明了一种全新的解决方案，利用独创的黏合剂将芯片层粘在一起。
IBM and 3m recently announced that they have a cool solution: a unique adhesive for packing the chip's layers.
在层板双面的上层都覆盖装饰面，形成一个完全结实黏合的整体。
Decorative overlays are applied to both faces, resulting in a complete solid and bonded structure.
为了取得这样的效果，黏合剂加入了黏液的特性，即使装置黏着在黏液层上。
To achieve this, an adhesive layer is added to the mucus-like properties, which allows the device to be stuck to the layer of mucus.
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