低/高温多层共烧陶瓷:低温共烧陶瓷基板(LTCC) 高温共烧陶瓷基板(HTCC)、我们拥有核心 低温共烧陶瓷技术的低温共烧陶瓷技术 LTCC与其它多层基板技术相比较，具有以下特点:(1)易于实现更多布线层数，提...
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高温共烧多层陶瓷基板 HTCC
多层共烧氮化铝陶瓷是采用厚膜印刷的方式将多层的电路金属化做入氮化铝基板并在特定气氛中高温烧结的一种高性能陶瓷。
Multilayer co-fired AlN ceramic is a type of high performance ceramic that is printed in thick film to form multilayer circuit and fired in a certain atmosphere in high temperature.
建立了与高温共烧多层陶瓷基板工艺相适应的工艺参数库、设计规则库和常用封装库，使Cadence公司的MCM系统能适合我所M CM - c设计。
The process data library, the design rule library and the package library were set up in CADENCEs MCM design system, based on high temperature co fire process.
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