方法和化学沉积浴场，半导体芯片上使用四个优先铜铜电解池。
Method and baths for electroless depositing Cu on a semiconductor chip using four preferred Cu electroless baths.
电铸版：是一种复制凸版式。先用蜡在原身版式或字版上套出铸模，把铜用电解法沉积于蜡铸上，然后用铅合金衬背而成。
Electrotype: a duplicate relief printing plate made electrolytically by depositing copper on a wax mould taken from an original plate or type and backing it with a lead alloy.
以氯化铜水溶液作电解液，在发光多孔硅薄膜表面上电沉积铜。
Microcrystals of metallic copper were electrochemically deposited onto the surface of porous silicon films in the aqueous electrolyte of copper(II) chloride.
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