铜基形状记忆合金是一种应用于机械、电气、能源、宇航、医学、日用工程等方面用于制作各种在温度变化时造成或形状记忆效应的敏感元件的铜基形状记忆合金
晶粒细化对Cu-12.2Al-4.0Mn形状记忆合金加工性能的影响 - TNMSC 关键字: 铜基形状记忆合金；塑性图；加工性能[gap=931]Key words: copper base shape memory alloy; plastic diagram; workability
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高温铜基形状记忆合金 high temperature cu-based shape memory alloy
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本文概述了高温铜基形状记忆合金的最新研究进展。
The recent developments of high temperature Cu-based shape memory alloy are reviewed.
本文通过研究铜基形状记忆合金的低频力学弛豫行为揭示其热弹性马氏体相变过程，从而拓展其应用领域。
In the paper, the mechanical relaxation behaviors in the Cu-based shape memory alloy were studied to reveal the process of the thermo-elastic martensitic transformation and to expand its applications.
介绍了铜基形状记忆合金的晶粒细化方法及机理，论述了晶粒细化对铜基形状记忆合金力学性能和记忆性能的影响。
The ways and the mechanisms of grain refinement in Cu-Base shape memory alloys are especially described. The effect of grain refinement on mechanical and memorial properties are discussed.
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