关键词： 连续铸造； 铜单晶； 力学性能； 电阻率 [gap=1540]Key words: continuous casting；single-crystal copper；mechanical properties；electrical resistivity
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The temperature at mold outlet, the flow rate of cooling water, the cooling distance, the melt temperature and the drawing speed were the major factors determined the process of the single crystal copper continuous casting.
确定结晶器出口温度、冷却水量、冷却距离、熔体温度、拉坯速度为铜单晶连铸实验的主要影响因素。
参考来源 - 铜单晶连铸工艺研究·2,447,543篇论文数据，部分数据来源于NoteExpress
铜单晶线材中位错蚀坑密度与材料浸蚀时间，变形量以及晶体学取向有关。
The dislocation etch pits density(EPD) of copper single wires is related with corroded time, deformative extent and crystal orientation of material.
大部分位错花样都是在单晶和多晶铜的室温疲劳试验中首先发现的。
Most dislocation patterns are discovered firstly at room temperature in the fatigued copper single crystals and polycrystals.
最后，讨论了原生直拉单晶硅中铜沉淀规律的机理。
Finally, the mechanism of copper precipitation in as-grown Czochralski silicon is discussed.
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