真空炉金锡封焊 - cynthia-huang的博客 - LED博客,中国LED网博客频道 关键词：金锡焊料；真空；炉温曲线 [gap=916]Key words: AuSn solder; vacuum; temperature curve
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通过这个电镀共沉积的过程，我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。
Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.
作为目前广泛使用的耗时长的固体贴装预制件的代替品，一种用电镀共沉积得到的金锡合金共晶焊料被用于该项研究中。
As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic au-sn alloy was used in this study.
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