金和锡的二元合金,共晶温度278℃,浓度为30%Sn。AuSn20、AuSn27和AuSn90等合金具有高的导热性,低的蒸气压,优良的耐蚀性,良好的浸润性和流动性。采用“热复合-冷轧”工艺制造,可轧制0.05~0.1mm的箔材。用于镀金或镀金合金的引线框架及引线的钎焊。在AuSn20合金中加入(50~300)×10-6的铂和/或钯的新钎料,有抑制钎料过分扩散和无规则漫流的作用,提高了钎焊效果。
荷兰锡金合金 Dutch pewter
金锡钎焊合金 gold-tin alloy
高锡铝合金双金属带 bimetal strip from tin-aluminium alloy
曼海姆铜锌锡代金合金 Mannheim gold
锡铅合金金属箔 tinsel
金锌锡合金 gold-zinc-tin alloys
金镍铬锡合金 gold-nickel-chromium-tin alloy
牛顿合金铋铅锡软合金 Newton'salloy
Furthermore, FEA is used to research the variety of thermal stress on the gold-tin eutectic solder layer between the normal power dissipation and the high temperature reflow process.
然后利用有限元分析手段,研究了高功率LED器件正常点亮和高温回流条件下,金锡合金焊层上的热应力分布变化。
参考来源 - 高功率LED封装的可靠性研究·2,447,543篇论文数据,部分数据来源于NoteExpress
然而,在另一个阳极电位更正的阳极溶解过程中,观察到在表面形貌上产生明显变化的原因是金锡合金的溶解。
However, at more anodic potentials another dissolution process was observed producing noticeable changes on the surface morphology which could be ascribed to the dissolution of a au-sn surface alloy.
作为目前广泛使用的耗时长的固体贴装预制件的代替品,一种用电镀共沉积得到的金锡合金共晶焊料被用于该项研究中。
As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic au-sn alloy was used in this study.
通过这个电镀共沉积的过程,我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。
Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.
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