因为它看起来已经损坏，芯片和裂缝是不是一个问题，为什么还要把它扔掉？

Since it already looks broken, chips and cracks are not a problem, so why would you throw it away?

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综述了铜在芯片微刻槽中电沉积填充的过程、机理 ，并着重讨论了实现无裂缝和无空洞理想填充的主要因素—镀液的组成和添加剂的影响。

The procedure and mechanism of copper filling in the trench of the chip are reviewed, the effect of electrolyte components and additives on superfilling are discussed.

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