一种半圆柱磁控溅射阴极，属于磁控溅射装置中的溅射源部件。
The utility model relates to a semi-circular column magnetic control sputtering cathode, belonging to a sputtering source component of a magnetron sputtering device.
介绍了设备的结构、 组成及工作过程，对新型矩形双平面磁控溅射阴极及有关的各阴极进行了分析、比较。
Describes the construction and working process of JPD-1200 we developed, and compares it with. Other cathods by discussing their different features.
该系统集脉冲阴极弧离子镀、直流阴极弧离子镀、磁控溅射和电子束蒸发等镀膜工艺以及气体和金属离子注入于一体。
The system include pulse cathodic arc ion deposition, direct current cathodic arc ion deposition, magnetic sputtering and electronic beam evaporation technologies.
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