0引言焊锡接点(Solder Joints)是微系统/器件封装技术中采用的主要结构互联方式.钎焊过程中,钎料(Solder)与铜焊盘(Cu Pad)发生化学反应和物理扩散过程生成的金属...
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These models neglect strain rate effects completely and obviously lead to inaccurate predictions of stresses and strains in solder joints.
由于这些材料模型完全忽略了应变率效应,会导致不准确的焊锡接点应力应变结果。
参考来源 - 跌落冲击载荷作用下焊锡接点的力学行为研究All the conclusions above could be regarded as the basis for the failure prediction of solder joints in electronic package design. It also provides convenient and feasible method for the study of the reliability of electronic package.
课题结论可以为将来合理可靠地预测电子封装焊锡接点失效提供依据,为电子封装可靠性研究提供方便快捷准确的方法。
参考来源 - 应变率效应对无铅焊锡接点跌落冲击力学行为的影响·2,447,543篇论文数据，部分数据来源于NoteExpress
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