Solder Paste Technology（焊膏工艺） Solder Powder ( 锡粉) Solder Paste Rheology（锡膏流变学） Solder Paste Composition & Manufacturing（锡膏成分和制造） .
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文章从线路板设计、焊膏选择、贴装控制等几个方面浅谈0201/01005元件装配工艺技术。
The article introduces 0201/01005 assembly process, including PCB design, the selection of solder paste and placement control, etc.
丝网印刷在双面印年刷电路板（ PCB）工艺中起着重要作用，最关键的环节是要掌握好网印到PCB焊盘上锡焊膏的量，要做到这一点，需要综合控制好多种工艺因素。
The key factor is the proper amount of tin solder to be screen printed onto welded surface of PCB. To do this well, it's necessary to control several technological factors.
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