电子组装的高密度给传统波峰焊接技术提出了新挑战。
The high density of electronics assembly has already bring up the new challenge to conventional wave soldering technology.
重点分析单相交流感应式液态金属电磁泵波峰焊接设备技术的工作原理、技术特征；
Analyse principle of operation, technology feature of single-phase alternating current induced liquid metal electromagnetic pump wave soldering machine.
采用先进封装技术，模块更结实，耐用，能耐280度高温度，能进行波峰焊接。
The modular sturdy and durable with advanced package technology, which could bear temperature 280 c.
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