桥连是指焊锡错误连接两个或多个相邻焊盘，在焊盘之间接触，形成的导电通路。在组装过程中，不同工艺阶段出现的问题都可能导致桥连。
... 在室温或用加热来除去焊膏中易挥发成分的过程（不管是否会导致树脂或松香的熔化）3.2稀释剂thinner 3.3桥连bridging 3.4粘附性tack ...
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The diode-laser soldering system, which is a new one, makes it possible to improve strength of QFP soldered joints, while also reducing bridging between the solder pads. Its applied field is getting larger and larger.
作为一项新兴的钎焊连接技术,半导体激光钎焊能有效避免桥连缺陷的产生,提高焊点强度,因此应用领域日益扩大。
参考来源 - QFP器件半导体激光无铅钎焊工艺研究·2,447,543篇论文数据，部分数据来源于NoteExpress
综述了双桥连二环戊二烯基金属有机化合物的研究进展。
The progress on the study of doubly bridged bis(cyclopentadienyl) metal complexes is reviewed.
从数值结果得出，建立的随机模型对于模拟纤维桥连是比较有效的。
From the numerical results, the established stochastic model is comparatively effective for simulating the fiber-bridging effect.
桥连现象是波峰焊接过程中最常见的一种焊接缺陷，其影响因素是多方面的。
Bridge phenomenon is a frequent defect in wave soldering, which have many affected factors.
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