冗余物缺陷是影响IC晶片成品率下降的重要原因，主要造成电路短路错误。
The redundancy material defect is an important factor of reducing the yield of IC, it mainly causes circuits to be connection failure.
万一出现，测量的平均厚度与技术要求的平均厚度出现偏差，晶片的成品率必须进行调整。
In case of deviation of the measured average thickness from the specified average value, the Wafer Yield adjustment has to come into force.
本发明提供一种半导体发光元件的制造方法，使蓝宝石晶片形成芯片时，能够以极高的成品率正确地形成芯片。
Provided is a method for manufacturing a semiconductor light emitting element, by which a sapphire wafer can be divided into chips accurately at an extremely high yield.
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