由于负向电流可以腐蚀削减铸层表面微观突起的生长高度，因此周期换向脉冲电流微电铸与单向正脉冲电流微电铸相比更易获得较好的铸层均匀性。
Because the height of micro tips on cathode surface can be eroded by the negative current, surface finishing is better in the micro-electroforming by periodic reverse pulse current than pulse current.
目前除采用一般的直流电外，根据实际的需要还可采用周期换向电流及脉冲电流。
At present in the general of dc outside, according to the actual need to still can use cycle reversing current and pulse current.
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