Package)、COF(Chip On Film)、或COG(Chip On Grass)的形式,并透过异方性导电胶膜(Anisotropic Conductive Film,ACF)压合焊接到LCD上。接着再进行印刷电路板(Printed Wiring Board,PWB)的进料,
基于4个网页-相关网页
Package)、COF(Chip On Film)、或COG(Chip On Grass)的形式,并透过异方性导电胶膜(Anisotropic Conductive Film,ACF)压合焊接到LCD上。接着再进行印刷电路板(Printed Wiring Board,PWB)的进料,
基于2个网页-相关网页
应用推荐