可在包括读出电路的第一衬底上方形成布线和层间介电层。
A wiring and interlayer dielectric layer may be formed over the first substrate including the readout circuit.
一第一层间导电接孔形成于且穿过一层间介电层以及一介电蚀刻停止层。
A first interlayer conductive joint hole is formed on and through an interlayer dielectric layer and a dielectric etch stop layer.
该第二层间导电接孔形成于且穿过该层间介电层，且与该第二平板电极相接触。
A second interlayer conductive joint hole is formed on and through the interlayer dielectric layer and is contacted with the second plate electrode.
应用推荐