小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
本文叙述了高密度封装的类型，介绍了它们的一般结构，并提供了封装的外形标准。
This paper presents some types of high density package, describes their general constructions and also shows the outline standards of these packages.
1D-板级扇出低成本的多晶片小外形封装；
1D- panel level fanout low cost multi-die small form factor packaging;
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