孔金属化是指各层印制导线在孔中用化学镀和电镀方法使绝缘的孔壁上镀上一层导电金属使之互相可靠连通的工艺。金属化孔双面印制板制造工艺的核心问题是孔金属化过程。金属化孔的要求是严格的,要求有良好的机械韧性和导电性,金属化铜层均匀完整,厚度在5一10 μm之间,镀层不允许有严重氧化现象,孔内不分层、无气泡、无钻屑、无裂纹,孔电阻在1000μΩ(十五所标准是500μΩ)以下。
2·原因分析及工艺调正 结合孔金属化(Plated Through Hole,PTH)工序维护的经验,对于可能引起镀层孔口起皮的工序和操作进行了分析和调正。
基于2个网页-相关网页
结合孔金属化 PTH ; Plated Through Hole
金属化孔 plated-through hole ; plated hole ; PTH ; Metal hole
非金属化孔 Unsupported hole ; NPTH ; Non-metal holes ; Non-metal through holes
最小非金属化孔 Finished Hole Dia
金属化孔贯穿连接 Hole Through Connection
介孔金属硫化物 mesostmctured metal sulfides
接着进行钻非金属化孔 Drilling Unplated
孔壁金属化 the via hole
介孔金属氧化物 mesoporous metal oxides
Through-hole plating in multilayer PCB is a key process of plating.
多层PCB的孔金属化是PCB制板的一个关键环节。
参考来源 - 孔金属化设备控制系统的硬件改进和软件设计The colloid palladium is used broadly in electroless industry, especially in the hole metallization of PCB.
胶体钯是化学镀行业,尤其是PCB孔金属化中应用最广泛的催化剂。
参考来源 - 新型盐基胶体钯制备及应用·2,447,543篇论文数据,部分数据来源于NoteExpress
镀层延展性好,平整、外观良好,可用于印制线路板的孔金属化及其它塑料电镀。
It can be used to metalize holes of PCB and plate on plastics.
金属铜的电阻率低,所以在印制电路板中,用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
本文在简单介绍印制板孔金属化加工技术的基础上,对微波印制板孔金属化加工技术进行了较为详细的论述。
The technology of the plating through hole of the printed circuit board was briefly introduced the plating through hole technology of the microwave printed circuit board were also illuminated.
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