低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。

Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules (MMCM).

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低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。

Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).

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在3d - MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。

In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.

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