玻璃的基本原料，包括硅砂和纯碱，几乎可以在任何地方找到。

The basic ingredients in glass, including silica sand and soda ash, are found almost everywhere.

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硅晶片通常都是从一块较大的硅上裁剪而来，此方式浪费了大概一半的圆晶原料。

Normally silicon wafers are cut from a larger piece of silicon. This wastes about half of the wafer material.

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当更多的硅投入市场后缺原料的担忧预计会结束，而薄膜的辉煌前景则可能在2008年暗淡下去。

The bright prospects for thin-film companies could dim in 2008, when more silicon will reach the market and the much-lamented shortage is expected to end.

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