适用范围：半导体硅片，光学玻璃，钟表件，眼镜，珠宝首饰，涤纶过滤芯等。
Applicable scope: semiconductor wafer, optical glass, horologe parts, glasses, jewelry, polyester filtering cores, etc.
用于雕刻玻璃、清洗铸件上的残砂、控制发酵、电抛光和清洗腐蚀半导体硅片(与HNO3的混酸)。
Used for engraving glass, cleaning residue on the sand casting, controlled fermentation, power semiconductor wafer polishing and cleaning corrosion (with HNO3 mixed acid).
在此详细介绍了DIP - CIB模块的内部电路、半导体硅片技术、封装技术，以及如何配合专用的HVIC来实现通用变频器的小型化设计。
This paper describes the internal circuit of the DIP-CIB module, semiconductor chip technologies, package technologies and general purpose inverter design by using HVIC and the DIP-CIB module.
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