用伪半固态触变成形技术能够成形陶瓷基复合材料，成形温度大大低于高熔点相纳米粉体熔化温度。
The ceramics matrix composites can be formed by pseudo-semi-solid thixoforming and the forming temperature was much lower than the melting temperature of the high-melting phase-nano-powder.
介绍了镁合金半固态触变成形技术中的三个关键技术：非枝晶组织半固态浆料的制备、坯料的二次加热、半固态触变压铸成形。
This paper introduced the key technology of SSP(semi-soild process) thixomolding of magnesium alloys : the preparation of non-dendritic structure, reheating, thixomolding.
本文采用上界理论解法，求解半固态A35 6铝合金触变成形力。
Upper bound theoretical solution is used in this paper to calculate the thixoforming force of semi solid A356 alloy.
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