对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装（CSP）进行了研究，描述了CSP的工艺流程；
Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.
因为制作过程中软性基板可能会发生弯曲或位移，它要与一片刚性玻璃临时粘合在一起。
Because the flexible material can curl or shift during this process, it's bonded temporarily to a rigid piece of glass.
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