光敏聚酰亚胺树脂 photosensitive polyimide resin
This is the mechanism of photosensitive polyimide's application in wafer fabrication.2) Photosensitive Polyimide is light sensitive material; if it is exposed to general light, chemical reaction will occur, thus make it not ready for work.
这就是光敏聚酰亚胺在晶圆制造中的应用机理。 3)光敏聚酰亚胺是光敏感物质,若暴露在一般光线下,将使之产生变化,而无法作好定像工作。
参考来源 - 晶圆制造过程中光敏型聚酰亚胺的应用及制程改良·2,447,543篇论文数据，部分数据来源于NoteExpress
光敏聚酰亚胺广泛用于微电子领域的绝缘层和保护层。
Photosensitive polyimides are widely used as protection and insulation layers for microelectronics.
光敏聚酰亚胺(PSPI)是兼有耐热性能和感光性能的一类高分子材料。
Photosensitive polyimide (PSPI) that possessed both heat-resistant and sensitive properties has attracted great interests in many fields.
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