人造金刚石由于其自身高的热导率、低的热膨胀系数和相对低的价格已成为制造新型散热材料的研究热点。

Synthetic diamond is competitive in heat dispersing materials, because it has high thermal conductivity, low coefficient of thermal expansion and lower price.

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塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。

First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.

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采用铅硼硅熔决釉研制出同时符合普通粘土瓦坯的烧成温度低、热膨胀系数低这两个主要性能特点的釉料。

The color glaze of low firing temperature and low expansion coefficient, to match the glaze tile made from common clay, was prepared in lead borosilicate system.

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